As isemiconductorkunye nobuchwephesha be-microelectronic buphuhlisela ukusebenza okuphezulu kunye nokuhlanganiswa okuphezulu, iimfuno eziphezulu zibekwe ekucocekeni kweegesi ezikhethekileyo zombane. Ubuchwephesha bemibhobho yegesi ecocekileyo yinxalenye ebalulekileyo yenkqubo yokubonelela ngegesi ecocekileyo. Yeyona teknoloji iphambili yokuhambisa iigesi ezicocekileyo ezihlangabezana neemfuno kwiindawo zokusetyenziswa kwegesi ngelixa zigcina umgangatho ofanelekileyo.
Ubuchwephesha bobuchwephesha bokucoceka obuphezulu bubandakanya uyilo oluchanekileyo lwenkqubo, ukukhethwa kwezixhobo zombhobho kunye nezinto ezincedisayo, ukwakhiwa kunye nokufakwa kunye nokuvavanya.
01Ingqiqo ngokubanzi yokuhanjiswa kwegesi
Zonke iigesi ezicocekileyo kunye nokucoceka okuphezulu kufuneka zihanjiswe kwindawo yokugcina igesi ngokusebenzisa imibhobho. Ukuze kuhlangatyezwane neemfuno zenkqubo yomgangatho wegesi, xa isalathisi sokuthumela ngaphandle kwegesi siqinisekile, kuyimfuneko ngakumbi ukunikela ingqalelo ekukhethweni kwezinto eziphathekayo kunye nomgangatho wokwakhiwa kwenkqubo yokubhobhoza. Ukongeza kokuchaneka kwemveliso yegesi okanye izixhobo zokucoca, ichaphazeleka kakhulu yizinto ezininzi zenkqubo yombhobho. Ngoko ke, ukukhethwa kwemibhobho kufuneka kuhambisane nemigaqo yoshishino lokucoca olufanelekileyo kunye nokumakisha izinto eziphathekayo zemibhobho kwimidwebo.
02Ukubaluleka kwemibhobho yococeko oluphezulu kuthutho lwegesi
Ukubaluleka kwemibhobho yokucoca okuphezulu ekuthuthweni kwegesi ecocekileyo Ngexesha lenkqubo yokunyibilikisa insimbi engenasici, itoni nganye inokufunxa malunga ne-200g yegesi. Emva kokuba insimbi engenasici icutshungulwe, ayipheleli nje ekungcoliseni izinto ezahlukeneyo ezincamathele kumphezulu wayo, kodwa nomlinganiselo othile werhasi ufunxwa kwileti yayo yesinyithi. Xa kukho ukuhamba komoya okudlula kumbhobho, inxalenye yerhasi efunxa yintsimbi iya kungena kwakhona kumoya kwaye ingcolise irhasi esulungekileyo.
Xa ukuhamba komoya kumbhobho kuyeka, umbhobho wenza i-adsorption yoxinzelelo kwigesi edlulayo. Xa i-airflow iyeka ukudlula, igesi ebhengezwa ngumbhobho yenza uhlalutyo lokunciphisa uxinzelelo, kwaye igesi ehlalutyiweyo iphinda ingene kwigesi ecocekileyo kumbhobho njengokungcola.
Ngelo xesha, i-adsorption and analysis cycle iya kubangela ukuba isinyithi kwindawo yangaphakathi yombhobho ivelise inani elithile le powder. Le nxalenye yothuli lwesinyithi ingcolisa igesi ecocekileyo kumbhobho. Olu phawu lombhobho lubaluleke kakhulu. Ukuze kuqinisekiswe ukucoceka kwegesi ehanjiswayo, akufuneki nje kuphela ukuba ubuso bangaphakathi bombhobho bube ne-smoothness ephezulu kakhulu, kodwa kufuneka ibe nokuchasana okuphezulu.
Xa irhasi ineempawu ezomeleleyo zokudla, kufuneka kusetyenziswe imibhobho yentsimbi engatyiwayo engatyiwayo. Ngaphandle koko, iindawo zokubola ziya kubonakala kwindawo yangaphakathi yombhobho ngenxa yokubola. Kwiimeko ezinzima, iziqwenga ezinkulu zetsimbi ziya kuxobuka okanye zigxuphuleke, ngaloo ndlela zingcolise irhasi ecocekileyo ehanjiswayo.
03Imathiriyeli yombhobho
Ukukhethwa kwezinto zombhobho kufuneka kukhethwe ngokweemfuno zokusetyenziswa. Umgangatho wombhobho ngokuqhelekileyo ulinganiswa ngokuhambelana noburhabaxa bendawo yangaphakathi yombhobho. Okuya kusezantsi uburhabaxa, kunqabile ukuba kuthwale amasuntswana. Ngokuqhelekileyo zahlulwe zibe ziindidi ezintathu:
Enye yiEP ibakala 316L umbhobho, eye yaphuculwa nge-electrolytically (Electro-Polish). Iyakwazi ukumelana nomhlwa kwaye inoburhabaxa obusezantsi. I-Rmax (incopho ephezulu ukuya kwintlambo yokuphakama) imalunga ne-0.3μm okanye ngaphantsi. Inowona mcaba uphezulu kwaye akukho lula ukwenza imisinga ye-micro-eddy. Susa amasuntswana angcolisekileyo. Irhasi yokusabela esetyenziswe kwinkqubo kufuneka ifakwe umbhobho kweli nqanaba.
Omnye ngu aBA ibakala 316Lumbhobho, oye waphathwa yi-Anneal eBright kwaye isoloko isetyenziselwa iigesi ezidibene ne-chip kodwa zingathathi nxaxheba kwinkqubo yokusabela, njenge-GN2 kunye ne-CDA. Omnye ngumbhobho we-AP (i-Annealing & Picking), engaphathwa ngokukodwa kwaye isetyenziswa ngokubanzi kwiiseti eziphindwe kabini zemibhobho yangaphandle engasetyenziswa njengemigca yokubonelela ngegesi.
04 Ukwakhiwa kwemibhobho
Ukucutshungulwa komlomo wombhobho yenye yezona zinto zibalulekileyo kule teknoloji yokwakha. Ukusikwa kwemibhobho kunye ne-prefabrication kuqhutyelwa kwindawo ecocekileyo, kwaye ngelo xesha, kuqinisekiswa ukuba akukho zimpawu ezinobungozi okanye umonakalo ebusweni bombhobho ngaphambi kokusika. Amalungiselelo okugungxulwa kwenitrogen kumbhobho kufuneka enziwe phambi kokuvula umbhobho. Ngokomgaqo, i-welding isetyenziselwa ukudibanisa ukucoceka okuphezulu kunye nokucoceka okuphezulu kwegesi yokuhanjiswa kunye nemibhobho yokusabalalisa kunye nokuhamba okukhulu, kodwa i-welding ngqo ayivumelekanga. I-Casing joints kufuneka isetyenziswe, kwaye izinto zombhobho ezisetyenzisiweyo zifunekayo ukuba kungabikho utshintsho kwisakhiwo ngexesha le-welding. Ukuba izinto ezinomxholo ophezulu wekhabhoni zixutywe, ukunyanzeliswa komoya kwenxalenye ye-welding kuya kubangela ukuba igesi ngaphakathi nangaphandle kombhobho ingene komnye nomnye, itshabalalise ubunyulu, ukoma kunye nokucoceka kwegesi yokuhambisa, okuya kukhokelela kwimiphumo emibi. kunye nokuchaphazela umgangatho wemveliso.
Isishwankathelo, kwi-high-purity kunye nemibhobho yothumelo lwegesi ekhethekileyo, kufuneka kusetyenziswe umbhobho wentsimbi ecocekileyo ococekileyo ococekileyo, owenza inkqubo yemibhobho ecocekileyo (kubandakanywa imibhobho, ukufakelwa kwemibhobho, iivalvu, iVMB, VMP) umsebenzi obalulekileyo ekuhanjisweni kwegesi ecocekileyo.
Ixesha lokuposa: Nov-26-2024